| Wire Bonding |
GMD155R60J105KE11D |
容值:1uF 电压:6.3V 温度系数(材质):X5R 偏差:±10% 封装/外壳:0402 |
| Wire Bonding |
GMD155R60J105KE11D |
容值:1uF 电压:6.3V 温度系数(材质):X5R 偏差:±10% 封装/外壳:0402 |
| Wire Bonding |
GMD033R60J104KE11D |
温度系数(材质):X5R 封装/外壳:0201 容值:100nF 偏差:±10% 电压:6.3V |
| Wire Bonding |
GMA05XR71H102MA01T |
容值:1nF 温度系数(材质):X7R 偏差:±20% 封装/外壳:0202 电压:50V |
| Wire Bonding |
GMD033R60J104KE11D |
温度系数(材质):X5R 封装/外壳:0201 容值:100nF 偏差:±10% 电压:6.3V |
| Wire Bonding |
GMD033R60J104KE11D |
温度系数(材质):X5R 封装/外壳:0201 容值:100nF 偏差:±10% 电压:6.3V |
| Wire Bonding |
GMA0D3R71A103KA01T |
容值:10nF 电压:35VDC 温度系数(材质):X7R 偏差:±10% 封装/外壳:015015 电压:10V |
